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 NCV1009 2.5 Volt Reference
The NCV1009 is a precision trimmed 2.5 V 5.0 mV shunt regulator diode. The low dynamic impedance and wide operating current range enhances its versatility. The tight reference tolerance is achieved by on-chip trimming which minimizes voltage tolerance and temperature drift. A third terminal allows the reference voltage to be adjusted 5.0% to calibrate out system errors. In many applications, the NCV1009Z can be used as a pin-to-pin replacement of the LT1009CZ and the LM136Z-2.5 with the external trim network eliminated. Features * 0.2% Initial Tolerance Max. * Guaranteed Temperature Stability * Maximum 0.6 W Dynamic Impedance * Wide Operating Current Range * Directly Interchangeable with LT1009 and LM136 for Improved Performance * No Adjustments Needed for Minimum Temperature Coefficient * Meets Mil Std 883C ESD Requirements * Extended Operating Temperature Range for Use in Automotive Applications * NCV Prefix, for Automotive and Other Applications Requiring Site and Change Control * Pb-Free Packages are Available
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http://onsemi.com MARKING DIAGRAMS
8 SOIC-8 D SUFFIX CASE 751 1 1009D ALYW G
TO-92 Z SUFFIX CASE 29
1009Z ALYWWG
G
A L Y WW, W G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
NC NC NC GND 1 8 NC NC VREF ADJ. PIN
5.0 V-35 V
Pin 1. ADJ. PIN 2. VREF 3. GND 1 23
3.6 kW VREF ADJ 10 kW TRIM
ORDERING INFORMATION
Device NCV1009D NCV1009DR2 *5.0% Trim Range If the external trim resistor is not used, the "ADJ. PIN" should be left floating. The 10k trim potentiometer does not effect the temperature coefficient of the device. NCV1009DR2G NCV1009Z NCV1009ZG Package SOIC-8 SOIC-8 SOIC-8 (Pb-Free) TO-92 TO-92 (Pb-Free) Shipping 95 Units/Rail 2500 Tape & Reel 2500 Tape & Reel 2000 Units/Rail 2000 Tape & Reel
GND
Figure 1. Application Diagram
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: NCV1009/D
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 9
NCV1009
VREF
10 pF
P3
N14
N16
15 pF
P1 14 kW 20 pF
P2
TRIM 20 kW 20 kW 10.15 kW 63 kW N7 N12 N13 30 kW ADJ N9 N10 N11 1.14 kW 6.785 kW D1 N15
N2 N1 N3 N4
N8
N5
N6 1.14 kW SUBSTRATE GND
Figure 2. Block Diagram
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NCV1009
MAXIMUM RATINGS*
Rating Reverse Current Forward Package Thermal Resistance, SOIC-8: Junction-to-Case, RqJC Junction-to-Ambient, RqJA Package Thermal Resistance, TO-92: Junction-to-Case, RqJC Junction-to-Ambient, RqJA Operating Temperature Range Storage Temperature Range Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1) Reflow: (SMD styles only) (Notes 2, 3) Value 20 10 45 165 - 170 -40 to +125 -65 to +150 260 peak 240 peak Unit mA mA C/W C/W C/W C/W C C C C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *The maximum package power dissipation must be observed. 1. 10 second maximum 2. 60 second maximum above 183C. 3. -5C / +0C allowable conditions.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified.)
Characteristic Reverse Breakdown Voltage Reverse Breakdown Voltage Reverse Breakdown Voltage Change with Current Reverse Dynamic Impedance IR = 1.0 mA -40C TA 125C 400 mA IR 10 mA (Note 4) IR = 1.0 mA (Note 4) Temperature Stability Average Temperature Coefficient Long Term Stabilty 0C TA 70C, (Note 5) 0C TA 70C, (Note 5) TA = 25C 0.1 C, IR = 1.0 mA Test Conditions Min 2.492 2.480 - - - - - - - Typ 2.500 2.500 2.6 3.0 0.2 0.4 1.8 15 20 Max 2.508 2.508 5.0 6.0 1.0 1.4 - - - Unit V V mV mV W W mV ppm/C ppm/kHr
4. Denotes the specifications which apply over full operating temperature range. 5. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.
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NCV1009
TYPICAL PERFORMANCE CHARACTERISTICS
10-1 REVERSE VOLTAGE CHANGE (mV) 1.4 1.8 REVERSE VOLTAGE (V) 2.2 2.6 5
REVERSE CURRENT (A)
10-2
4
3
10-3
2
10-4 TJ = 25C 1.0
1
10-5 0.5
0 0 4 8 12 16 REVERSE CURRENT (mA) 20
Figure 3. Reverse Current vs. Reverse Voltage
Figure 4. Change in Reverse Voltage vs. Reverse Current
1.2 FORWARD VOLTAGE (V) TJ = 25C 1.0 0.8 0.6 0.4 0.2 0 0.001
100 DYNAMIC IMPEDANCE (W) 0.01 0.1 1.0 10
10
1.0
0.1 10
100
FORWARD CURRENT (mA)
1.0 k 10 k FREQUENCY (Hz)
100 k
Figure 5. Forward Voltage vs. Forward Current
Figure 6. Dynamic Impedance vs. Frequency
250 FORWARD VOLTAGE (V) VOLTAGE SWING (V) IR = ImA TJ = 25C NOISE (nV/HZ) 200 0 2.5 2.0 1.5 1.0 0.5 0 5.0 k INPUT OUTPUT
150
100 10.0 4.0 0 10 100 1.0 k FREQUENCY (Hz) 10 k 100 k
50
0
1 TIME (ms)
20
Figure 7. Zener Noise Voltage vs. Frequency
Figure 8. Response Time
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NCV1009
PACKAGE DIMENSIONS
SOIC-8 CASE 751-07 ISSUE AG
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
-X- A
8 5
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060 7.0 0.275 4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCV1009
PACKAGE DIMENSIONS
TO-92 CASE 29-11 ISSUE AL
A R P L
SEATING PLANE
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 ---
K
XX G H V
1
D J C SECTION X-X N N
DIM A B C D G H J K L N P R V
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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6
NCV1009/D


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